Welcome to our Momentum factory construction update article! Here, you’ll find weekly snapshots, videos, and highlights as we bring this project from blueprint to reality. Follow along to witness our progress each step of the way, from laying the foundation to final installations.

Momentum just released new design for ultra-low noise LNA chip for fabrication.

• Integrated LNA with on chip bias and switch circuit
• Three design covering 130-450MHz, 700-1000MHz, 2.4GHz
• System level NF well below 1dBm
• High gain
• Enhance ESD reliability

The new platform will be partially available for new products from 3Q2024 and will be fully available by 1Q2025.

The programs involve custom chip development and enhance firmware. Advantages include, but are not limited to:

• Enhanced PAE for up to 55% efficiency
• Enhanced EMI performance
• Max Pin up to 7dBm with a single chip power gain to respective output required
• Enhanced ESD stability

The new RF PA chip is now undergoing full mask and subsequent testing. These solutions will be deployed in 2-way radio production by 1Q2025.

The Faculty of Electrical & Electronics Engineering, Ho Chi Minh City University of Technology has held the Scholarship Award Ceremony on May 15 for the award of scholarships donated by our group.

10 scholarships were awarded for students with good, excellent academic results and 10 scholarships were awarded for students with difficult family circumstances who remain strived to excel in their studies.

Momentum sponsors full tuition fees for employees pursuing Master's degrees, unlocking their potential through continuous learning.

Momentum has officially signed up and committed to established its first Vietnam factory at Tan Thuan Export Processing Zone with a target to commence production by 4Q2024.

The 6,000 square meters facility will be home to 600 staffs, 5 SMT lines & a plastic manufacturing operation with 35+ injection machines.

The Company has strong R&D capabilities and provides Original Design Manufacturing service to customers in telecommunication, healthcare, home automation & industrial applications.

The programs involve custom chip development and enhance firmware. Advantages include, but not limited to:

• Reduced power consumption
• Enhanced audio performance
• Enhanced reliability of the RF transceiver
• Enabled active audio enhancement as an option

The new platform will be partially available for new products from 3Q2024 and will be fully available by 1Q2025.