The programs involve custom chip development and enhance firmware. Advantages include, but are not limited to:
- Enhanced PAE for up to 55% efficiency
- Enhanced EMI performance
- Max Pin up to 7dBm with a single chip power gain to respective output required
- Enhanced ESD stability
The new RF PA chip is now undergoing full mask and subsequent testing. These solutions will be deployed in 2-way radio production by 1Q2025.